Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10487404 | Adhesion promoting process for metallisation of substrate surfaces | Zhiming Liu, Hailuo Fu, Sara Hunegnaw | 2019-11-26 |
| 10249572 | Method for electromagnetic shielding and thermal management of active components | Kenichiroh Mukai, Kwonil Kim, Lee Gaherty, Tafadzwa Magaya | 2019-04-02 |