Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10465056 | Method for producing flexible conductive substrate with high transmittance and product thereof | Wei-Ping Dow, Liang-Jie Lin, Hung-Ming Chang, Ting-Yun Lin, Fang Lin | 2019-11-05 |