Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504801 | Method and apparatus for detecting and removing defective integrated circuit packages | Hui Yin, Qing Bo Wu, Tian Sheng Chen, Guan Quan Wen, Ding Han | 2019-12-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504801 | Method and apparatus for detecting and removing defective integrated circuit packages | Hui Yin, Qing Bo Wu, Tian Sheng Chen, Guan Quan Wen, Ding Han | 2019-12-10 |