Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10399170 | Die attachment apparatus and method utilizing activated forming gas | Pingliang Tu, Zhao Yang, Jun Qi, Chun Hung Samuel Ip | 2019-09-03 |
| 10311597 | Apparatus and method of determining a bonding position of a die | Shun Ming Fung, Chi Keung Leung, Wing Kin Lam, Yuet Keung Cheung | 2019-06-04 |