Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10247488 | Heat dissipation device | Yuan-Yi Lin | 2019-04-02 |
| 10190830 | Thermal module assembling structure | Kuo-Sheng Lin | 2019-01-29 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10247488 | Heat dissipation device | Yuan-Yi Lin | 2019-04-02 |
| 10190830 | Thermal module assembling structure | Kuo-Sheng Lin | 2019-01-29 |