Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10208206 | Curable resin composition and cured product thereof, sealing material for optical semiconductor, die bonding material, and optical semiconductor light-emitting element | Ryoko Watanabe, Tamotsu Kodama | 2019-02-19 |