Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10363629 | Mitigation of particle contamination for wafer dicing processes | Wei-Sheng Lei, Ajay Kumar, Brad Eaton | 2019-07-30 |
JP
Jungrae Park
Overall (2019): #398,011 of 560,194Top 75%
1
Patents 2019