Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10455707 | Connection pad for embedded components in PCB packaging | Kenneth Leland Kiplinger, Mark J. Beesley, Shyam Harindralal Ratnayake, Meng Chi Lee | 2019-10-22 |
| 10423815 | Capacitive sensor packaging | Benjamin J. Pope, Barry Corlett, Terry L. Gilton, Syed Husaini, Steven Webster +3 more | 2019-09-24 |
| 10420213 | Segmented via for vertical PCB interconnect | Mark J. Beesley, Albert A. Onderick, II, Anne M. Mason, Craig A. Gammel | 2019-09-17 |
| 10179254 | Capacitor structure with acoustic noise self-canceling characteristics | Paul A. Martinez, Jason C. Sauers | 2019-01-15 |