Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10522475 | Vertical interconnects for self shielded system in package (SiP) modules | Meng Chi Lee, Shakti Singh Chauhan, Jun Chung Hsu, Tha-An Lin | 2019-12-31 | $109,024,000 |