Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10470307 | Circuit substrate with embedded heat sink | Venkataram R. Raju, Yazan Z. Alnahhas | 2019-11-05 |
| 10455738 | Stacked circuit board architecture in an electronic device | David A. Pakula, Daniel W. Jarvis, Gregory N. Stephens, Ian A. Spraggs, Vu T. Vo +5 more | 2019-10-22 |