Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490510 | Cavity package with composite substrate | Dipak Sengupta | 2019-11-26 |
| 10287161 | Stress isolation features for stacked dies | Michael J. Zylinski, Thomas M. Goida, Kathleen O'Donnell | 2019-05-14 |