Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10327076 | Top port MEMS package and method | Bob Shih-Wei Kuo, Louis B. Troche, Jr. | 2019-06-18 |
| 10236268 | Robust pillar structure for semicondcutor device contacts | Karthikeyan Dhandapani, Sundeep Nand Nangalia | 2019-03-19 |