Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431533 | Circuit board with constrained solder interconnect pads | Andrew KW Leung | 2019-10-01 |
| 10403589 | Interconnect etch with polymer layer edge protection | — | 2019-09-03 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431533 | Circuit board with constrained solder interconnect pads | Andrew KW Leung | 2019-10-01 |
| 10403589 | Interconnect etch with polymer layer edge protection | — | 2019-09-03 |