Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10438813 | Semiconductor device having one or more titanium interlayers and method of making the same | Wei He, Chris Wiebe | 2019-10-08 |
| 10424654 | Power device with high aspect ratio trench contacts and submicron pitches between trenches | Wenjun Li, Paul Thorup, Hong Chang, Yeeheng Lee, Yang Xiang +2 more | 2019-09-24 |
| 10170559 | Reverse conducting IGBT incorporating epitaxial layer field stop zone and fabrication method | Lei Zhang, Brian Schorr, Chris Wiebe, Wenjun Li | 2019-01-01 |