Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10507552 | Solder material and electronic component | Toshimasa Tsuda, Kenichi Kikuchi, Tomotaka Kuroda, Daisuke Nishiyama, Hiroyuki Sasaki +1 more | 2019-12-17 |
| 10344865 | Sealing device | Kota Henmi, Shuji Yoshitsune | 2019-07-09 |