Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10229894 | Semiconductor package structure and semiconductor process | Shih-Ming Huang, Chun-Hung Lin, Yi-Ting Chen, Wen-Hsin Lin, Shih-Wei Chan | 2019-03-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10229894 | Semiconductor package structure and semiconductor process | Shih-Ming Huang, Chun-Hung Lin, Yi-Ting Chen, Wen-Hsin Lin, Shih-Wei Chan | 2019-03-12 |