Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354969 | Substrate structure, semiconductor package including the same, and method for manufacturing the same | Chih-Cheng Lee | 2019-07-16 |
| 10340212 | Semiconductor package structure having a heat dissipation structure | Chih-Cheng Lee | 2019-07-02 |
| 10332757 | Semiconductor device package having a multi-portion connection element | Chih-Cheng Lee | 2019-06-25 |
| 10270184 | Control module and multiple-antenna device having the same | Ming-Chia Lee, Hong-Fang Yan | 2019-04-23 |