Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522505 | Semiconductor device package and method for manufacturing the same | Chih-Ming Hung, Tsung-Yueh Tsai, Jen-Kai Ou | 2019-12-31 |
| 10242940 | Fan-out ball grid array package structure and process for manufacturing the same | Jung-Liang YEH, Tsung-Yueh Tsai, Chih-Ming Hung | 2019-03-26 |