Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431554 | Semiconductor device package and method of manufacturing the same | I-Chia Lin, Chieh-Chen Fu, Kuo-Hsien Liao | 2019-10-01 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431554 | Semiconductor device package and method of manufacturing the same | I-Chia Lin, Chieh-Chen Fu, Kuo-Hsien Liao | 2019-10-01 |