CL

Chung-Hsien Lee

AI Acer Incorporated: 1 patents #48 of 126Top 40%
ME Mediatek: 1 patents #173 of 483Top 40%
📍 New Taipei, TW: #327 of 2,150 inventorsTop 20%
Overall (2019): #184,690 of 560,194Top 35%
2
Patents 2019

Issued Patents 2019

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10497176 Packing structure Shu-Hsien Chung, Jhih-Hsien Wu, Ming-Haw Wang 2019-12-03
10418002 Merged access units in frame buffer compression Ping Chao, Ting-An Lin, Tung-Hsing Wu, Kung-Tsun Yang, Wan-Yu Chen +8 more 2019-09-17