Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10425555 | Method to form a coarsely discretized 3-D decoration | — | 2019-09-24 |
| 10418355 | Optoelectronic semiconductor chip and method for fabrication thereof | Rainer Butendeich, Matthias Peter, Tobias Meyer, Tetsuya Taki, Hubert Maiwald | 2019-09-17 |
| 10388828 | Light-emitting semiconductor chip | Matthias Peter, Tobias Meyer, Tetsuya Taki, Juergen Off, Rainer Butendeich +1 more | 2019-08-20 |