Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147641 | 3D IC method and device | Paul M. Enquist, Gaius Gillman Fountain, Jr. | 2018-12-04 |
| 10141218 | Room temperature metal direct bonding | Paul M. Enquist, Anthony Scot Rose | 2018-11-27 |