AY

Akira Yamauchi

BC Bondtech Co.: 1 patents #1 of 2Top 50%
UN Unknown: 1 patents #265 of 3,190Top 9%
📍 Kyoto, MI: #10 of 11 inventorsTop 95%
Overall (2018): #496,932 of 503,207Top 100%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9870922 Substrate bonding apparatus and substrate bonding method Tadatomo Suga 2018-01-16