Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103230 | Methods of forming buried junction devices in silicon carbide using ion implant channeling and silicon carbide devices including buried junctions | Alexander V. Suvorov, Vipindas Pala, Lin Cheng | 2018-10-16 |
| 9972677 | Methods of forming power semiconductor devices having superjunction structures with pillars having implanted sidewalls | Vipindas Pala, Lin Cheng, Daniel Jenner Lichtenwalner | 2018-05-15 |
| 9887287 | Power semiconductor devices having gate trenches with implanted sidewalls and related methods | Daniel Jenner Lichtenwalner, Brett Hull, Alexander V. Suvorov, Craig Capell | 2018-02-06 |