Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE47151 | Assembly of an electronic device casing, a heat-dissipating module and a waterproofing module, waterproofing module, and electronic device | Po-Yuan Hsu, Wei Wang, Chen-Yu Li, Hsing-Wang Chang, Chia-Cheng Su | 2018-12-04 |