Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163762 | Lead frame with conductive clip for mounting a semiconductor die with reduced clip shifting | Hui Ding, Pengnian Wang, Tao Yu, Jun Liu, Chih-Ping Peng | 2018-12-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163762 | Lead frame with conductive clip for mounting a semiconductor die with reduced clip shifting | Hui Ding, Pengnian Wang, Tao Yu, Jun Liu, Chih-Ping Peng | 2018-12-25 |