Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10026660 | Method of etching the back of a wafer to expose TSVs | Laura Mauer, John Taddei, John Clark, Elena Lawrence, Eric Kurt Zwirnmann +1 more | 2018-07-17 |
| 9870928 | System and method for updating an arm scan profile through a graphical user interface | David Goldberg | 2018-01-16 |