Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10065855 | Integrated circuit comprising multi-layer micromechanical structures with improved mass and reliability by using modified vias and method for forming the same | Daniel Fernández Martínez, Jordi Madrenas Boadas | 2018-09-04 |