Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163707 | Method for forming group III-V device structure | Ming-Hong Chang, Hsin-Chih Lin, Shen-Ping Wang, Chung-Cheng Chen, Po-Tao Chu | 2018-12-25 |
| 10134867 | Method for fabricating semiconductor device | Jheng-Sheng YOU, Hsin-Chih Lin, Kun-Ming Huang, Lieh-Chuan Chen, Po-Tao Chu +1 more | 2018-11-20 |
| 9947640 | Wafer, package structure and method of manufacturing the same | — | 2018-04-17 |
| 9941384 | Semiconductor device and method for fabricating the same | Jheng-Sheng YOU, Hsin-Chih Lin, Kun-Ming Huang, Lieh-Chuan Chen, Po-Tao Chu +1 more | 2018-04-10 |
| 9929081 | Interposer fabricating process | — | 2018-03-27 |