Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10159151 | Chip package circuit board module | Wen-Fang Liu, Chen W. Tseng, Zong-Hua Li, Chien-Tsai Li | 2018-12-18 |
| 10056356 | Chip package circuit board module | Wen-Fang Liu, Chen W. Tseng, Zong-Hua Li | 2018-08-21 |