Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10099218 | Method for manufacturing and/or packaging a chip | Lei Wang, Xinying Zhou, Juan Xin, Mingxian Lin, Jinhai Feng | 2018-10-16 |
| D823148 | Air battery testing device | Li Qian, Yu-Quan Wang, Fu-Jun Wang, Xue-Wei Guo, Yang Wu | 2018-07-17 |
| 9915005 | Additive C capable of changing microvia-filling method by TSV copper plating, and electroplating solution containing same | Su-Chee Simon Wang, Xianxian Yu, Yanyan Li | 2018-03-13 |
| 9856572 | Additive for reducing voids after annealing of copper plating with through silicon via | Su-Chee Simon Wang, Xianxian Yu, Yanyan Li | 2018-01-02 |