Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049952 | Method of fabricating a semiconductor module with a inclined groove formed in resin side surface | Takuya Kadoguchi, Takahiro HIRANO, Shigeru Hayashida | 2018-08-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049952 | Method of fabricating a semiconductor module with a inclined groove formed in resin side surface | Takuya Kadoguchi, Takahiro HIRANO, Shigeru Hayashida | 2018-08-14 |