Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9966332 | Solid-state device including a conductive bump connected to a metal pattern and method of manufacturing the same | Satoshi Wada, Koji Tasumi | 2018-05-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9966332 | Solid-state device including a conductive bump connected to a metal pattern and method of manufacturing the same | Satoshi Wada, Koji Tasumi | 2018-05-08 |