TS

Takahiro Setaka

TC Tokyo Ohka Kogyo Co.: 1 patents #36 of 111Top 35%
Overall (2018): #219,622 of 503,207Top 45%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9962915 Bonding method and bonding apparatus Atsushi Miyanari, Yoshihiro Inao, Shigeru Kato, Shingo Ishida 2018-05-08