Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10138556 | Plating method, plating apparatus, and storage medium | Nobutaka Mizutani, Takashi Tanaka | 2018-11-27 |
| 10030308 | Plating method, plating system and storage medium | Takashi Tanaka, Yuichiro Inatomi, Nobutaka Mizutani, Yusuke Saito | 2018-07-24 |
| 9966306 | Catalyst layer forming method, catalyst layer forming system and recording medium | Yuichiro Inatomi, Takashi Tanaka, Nobutaka Mizutani, Yusuke Saito, Kazutoshi Iwai | 2018-05-08 |
| 9888585 | Method for manufacturing wiring structure, copper displacement plating solution, and wiring structure | Shoso Shinguhara, Kohei Ota, Nobutaka Mizutani | 2018-02-06 |