Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10083896 | Methods and apparatus for a semiconductor device having bi-material die attach layer | Rongwei Zhang | 2018-09-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10083896 | Methods and apparatus for a semiconductor device having bi-material die attach layer | Rongwei Zhang | 2018-09-25 |