Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9960135 | Metal bond pad with cobalt interconnect layer and solder thereon | Helmut Rinck, Gernot Manfred Bauer, Kai-Alexander Schachtschneider, Michael Otte, HARALD WIESNER | 2018-05-01 |