DL

Daniel Yong Lin

TI Texas Instruments: 1 patents #413 of 1,145Top 40%
Overall (2018): #443,883 of 503,207Top 90%
1
Patents 2018

Issued Patents 2018

Patent #TitleCo-InventorsDate
9941194 Packaged semiconductor device having patterned conductance dual-material nanoparticle adhesion layer Benjamin Stassen Cook 2018-04-10