Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9934989 | Process for forming leadframe having organic, polymerizable photo-imageable adhesion layer | Jaimal Mallory Williamson, Jose Carlos Arroyo | 2018-04-03 |
| 9875930 | Method of packaging a circuit | Abram Castro | 2018-01-23 |