Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134770 | Preparation method of conductive via hole structure, array substrate and display device | Yinhu Huang, Zhixiang Zou, Binbin Cao | 2018-11-20 |
| 10049147 | Method, apparatus and terminal for processing documents | Yi Shan, Bin Zhang, Likai Wang, Zhuo Tang, Liang Wu +2 more | 2018-08-14 |
| 9908313 | Process for bonding lignocellulosic substrates without an added adhesive and products thereof | Scott RENNECKAR, William T. Church, Jeffrey A. Dolan, Robert Steven Wright | 2018-03-06 |