Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103095 | Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect | Kelvin Po Leung Pun | 2018-10-16 |
| 9974188 | Patterning of graphene circuits on flexible substrates | Kelvin Po Leung Pun | 2018-05-15 |