Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10150185 | Method for producing metal ball, joining material, and metal ball | Hiroyoshi Kawasaki, Takahiro Roppongi, Daisuke Soma | 2018-12-11 |
| 10147695 | Cu core ball | Hiroyoshi Kawasaki, Tomohiko Hashimoto, Atsushi Ikeda, Takahiro Roppongi, Daisuke Soma +1 more | 2018-12-04 |
| 10137535 | Cu ball, Cu core ball, solder joint, solder paste, and solder foam | Hiroyoshi Kawasaki, Takahiro Roppongi, Daisuke Soma | 2018-11-27 |
| 9956634 | Device for coating thin molten solder film, thin solder film-covered component and manufacturing method therefor | Koji Watanabe, Kota Kikuchi, Michio Suzuki, Naoto Kameda, Hideki Nakamura | 2018-05-01 |