Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9960133 | Filter and capacitor using redistribution layer and micro bump layer | Hsiao-Tsung Yen, Jhe-Ching Lu, Chin-Wei Kuo, Min-Chie Jeng | 2018-05-01 |
| 9923101 | Semiconductor structure | Hsiao-Tsung Yen, Chin-Wei Kuo, Ho-Hsiang Chen, Chewn-Pu Jou, Min-Chie Jeng | 2018-03-20 |
| 9893241 | Light emitting device having bonding pads formed therein for packaging | Chao-Hsing Chen, Jia-Kuen Wang, Tzu-Yao Tseng, Bo-Jiun Hu, Tsung-Hsun Chiang +4 more | 2018-02-13 |