Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163825 | Semiconductor structure and manufacturing method thereof | Huan-Neng Chen | 2018-12-25 |
| 10116030 | Integrated fan-out package including dielectric waveguide | Chewn-Pu Jou | 2018-10-30 |
| 10037897 | Inter-fan-out wafer level packaging with coaxial TIV for 3D IC low-noise packaging | Feng-Wei Kuo | 2018-07-31 |
| 9991216 | Antenna cavity structure for integrated patch antenna in integrated fan-out packaging | Chewn-Pu Jou, Feng-Wei Kuo | 2018-06-05 |
| 9941195 | Vertical metal insulator metal capacitor | Chewn-Pu Jou | 2018-04-10 |