WL

Wei-Jung Lin

TSMC: 1 patents #1,476 of 2,904Top 55%
Overall (2018): #196,755 of 503,207Top 40%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9978583 Opening fill process and structures formed thereby Chun-I Tsai, Chi-Yuan Chen, Chia-Han Lai 2018-05-22