Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163794 | Capping layer for improved deposition selectivity | Chao-Chun Wang | 2018-12-25 |
| 10163795 | Electro-migration barrier for Cu interconnect | Chih-Chiang Chang, Chia-Ho Chen | 2018-12-25 |