Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049965 | Through-substrate vias and methods for forming the same | Ming-Fa Chen, Yu-Young Wang | 2018-08-14 |
SJ
Sen-Bor Jan
Overall (2018): #245,576 of 503,207Top 50%
1
Patents 2018