Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10014272 | Die bonding with liquid phase solder | Dewen Tian, Yiu Ming Cheung | 2018-07-03 |
| 9944108 | Sticky note pad | Tsung-Tien Kuo, Jen-Rong Liu, Tsun-Rung Hsu, Chih-Wei Hsu | 2018-04-17 |
| 9908356 | Carbonless copy note pad | Tsung-Tien Kuo, Hsien-Min Kuo, Ho-Tsai Lin | 2018-03-06 |