Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10074594 | Semiconductor structure and manufacturing method thereof | Chih-Chang Huang, Jung-Chih Tsao, Yao-Hsiang Liang, Yu-Ku Lin | 2018-09-11 |
| 9991204 | Through via structure for step coverage improvement | Jung-Chih Tsao, Yao-Hsiang Liang, Yu-Ku Lin | 2018-06-05 |
| 9859124 | Method of manufacturing semiconductor device with recess | Jung-Chih Tsao, Yao-Hsiang Liang, Yu-Ku Lin | 2018-01-02 |