HL

Hsiang-Wei Lin

TSMC: 3 patents #702 of 2,904Top 25%
📍 New Taipei, TW: #172 of 1,960 inventorsTop 9%
Overall (2018): #73,595 of 503,207Top 15%
3
Patents 2018

Issued Patents 2018

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
10157779 Multi-barrier deposition for air gap formation 2018-12-18
10109522 Method for forming semiconductor structure Yi-Nien Su 2018-10-23
9887128 Method and structure for interconnection 2018-02-06